![]() No Specific Geometry Results Geometry Model was Integrated with Reliability Model to Predict Effect of Process Variability on Joint Fatigue Life Numerical Solution of BVP Energy Minimization by Ritz Method Ellipticĭrops on Finite Pad Sample Profiles of C4 JointsĮnergy Minimization by Finite Element Method Samples of Top Fillet Profiles Fillet Volume vs. Numerical Solution of BVP with and without Gravity Circular Arc Meridian Volumes of Joint Solder and Control Solder Joint Geometry Using Approximate Solutionsīump Height vs. Numerical Solution of BVP Truncated Sphere Circular Arc Meridian Within 0.5% of True Minimum- Energy StateĬircular Arc Approximation is Invalid for Larger Pad Numerical Results are for Specific Pin and Hole Literature Involving Models for Predicting Axisymmetric Joint Geometries Contact Angle and Bump HeightĮqual Pad Radii Count Ratio Results are Problem-Specific Reflow of Long (Channel-Type) Solder Bumpsīump Volume and Bump Force vs. Perfect Wettability Joint Size Estimated by "Equivalent Dipping Model" Horizontal Conveyor Angle Joint Size Estimated by "Equivalent Dipping Model"įillet Size, Shape, Contact Angles as Functions of Metallization Dimensions Effect of Conveyor Angle Included Numerical Results are Problem- Specific Infinite Tinningįillet Size & Shape vs. Solder Area (Volume) Closed-Form Expressions for Small & Large Joint Profiles and for Maximum Fillet Height Numerical Solution of BVP for Fillet Profile Numerical Solution ofįillet Height & Length vs. Tombstone Prevention & Self- Alignment Enhancement Reflow of Leadless Chips: Tombstone Prevention ![]() Literature Involving Models for Predicting 2-D Joint Geometries If you are aware of any relevant publications that are not included in this summary, please send copies to the address below: Heinrich, S.M., "Prediction of Solder Joint Geometry," Chapter 5 of Mechanics of Solder Alloy Interconnects, Frear et al. This material represents an updated version of the tables and bibliography that appear in the following reference: On the following pages is a summary of several papers that have been published in the area of solder joint geometry modeling. ![]()
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